Diodes latest product newsletter 2024 second issue

This blog mainly introduces Diodes' 2024 second phase new products: PCIe clock generator, PCIe clock buffer, MOSFET high-side power switch.

1. PCIe clock generator: PCIe 6.0/5.0/4.0 clock generator series that meets automotive specifications and has multiple outputs, suitable for connected driving product applications

The PI6CG33xQ is a family of low-power, HCSL (High Speed Current Control Logic), automotive-qualified PCIe 6.0 clock generators. These devices are available in 2, 4, 6 and 8 outputs and are backward compatible with all earlier versions of the PCIe protocol.

This series of devices uses a 25MHz crystal or CMOS as a reference input signal and generates multiple 100MHz differential HCSL output signals through on-chip termination resistors (On-Chip Termination). On-chip termination resistors eliminate the requirement for four external resistors per output port, thus saving board space.

All PI6CG33xQ family devices feature independent output capabilities to improve power management. Both the slew rate and amplitude can be adjusted through the SMBus interface, allowing users to set up the device to optimize performance for their different boards.

Ultra-low jitter (<40fsRMS) enables robust and reliable PCIe 6.0 system designs with good timing margins

Temperature range: -40ºC to +105ºC

Product packaging: Wettable Flank QFN (compliant with AEC-Q100 Grade 2 specifications)

PI6CG33xQ Typical Applications

2. PCIe clock buffer: PCIe 6.0/5.0 clock buffer with 6, 8 and 12 outputs, supporting zero latency/fan-out mode

The PI6CBE33xx3 series are PCIe 5.0/6.0 clock buffer products with 6, 8 and 12 lanes of low-power HCSL outputs with on-chip termination resistors and 33Ω output impedance.

The device can be programmed into zero-delay buffer (ZDB) or fan-out buffer mode through hardware or SMBus controls.

Independent OE pins for each channel provide flexible power management capabilities. Clock frequencies of 100MHz or 133.33MHz are supported in ZDB mode and 1MHz to 400MHz in fan-out buffer mode.

Low additive phase jitter improves system timing margin in high-speed connectivity product applications

Low additive phase jitter of 12fs in fan-out buffer mode to minimize phase noise and improve system timing margin

Product package: TQFN (5x5mm to 9x9mm)

Typical server applications of PI6CBE33xx3 series

3. High-side power switch: It can provide comprehensive protection for high surge current loads for dual-channel high-side power supplies.

The IntelliFETs® product line of the ZXMS82xxxS14PQ series are automotive-qualified dual-channel smart high-side power switching devices specifically designed to handle high inrush current loads while providing strong protection for the device itself and the connected load. These switching products are particularly suitable for driving automotive loads, including inductive, capacitive and resistive loads.

These integrated controllers provide protection from a variety of potentially damaging events, such as overvoltage, overheating, short circuits, and electrostatic discharge.

Each device features vertical DMOS MOSFETs with different RDS(ON) (typ. 25°C):

ZXMS82090S14PQ 75mΩ

ZXMS82120S14PQ 100mΩ

ZXMS82180S14PQ 150mΩ

Built-in diagnostics detect fault conditions and self-protection events, including open load, overload, and thermal shutdown. Additional protection against reverse polarity and ground failure can be easily implemented with minimal additional components.

Provides compact dual-channel solution to safely drive automotive loads

Diagnostics using current sensing

Product package: SO-14EP (with exposed bottom heat sink for high thermal efficiency)

If you need data sheets, sample testing, procurement, BOM distribution and other requirements for the above products, please contact us through the following contact:

• [email protected][email protected][email protected]

Introduction to DIODES Semiconductors

Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.