On June 3rd, according to a report from South Korean media outlet ETNews, Micron is rapidly becoming a significant threat to SK Hynix and Samsung Electronics, the two major storage companies in South Korea, due to its outstanding energy efficiency in the HBM memory field.
Traditionally, Micron has been at a disadvantage in the HBM sector due to various factors. However, in 2022, Micron boldly decided to cease production of HBM3 and instead focus on the research and improvement of HBM3E memory.
This decision has yielded fruitful results: Micron has secured orders from Nvidia, the largest customer for HBM, and has begun shipping HBM3E memory to Nvidia's H200 AI GPU.
One of the key reasons for Micron's rapid emergence as a threat to South Korean manufacturers is its energy efficiency advantage. Micron claims that its 8Hi stacked 24GB HBM3E memory consumes 30% less power compared to competitors.
In the current surge of AI demand, low power consumption technology has become a focal point in the industry. The more energy-efficient HBM3E memory can reduce system heat and electricity consumption, decrease cooling requirements, and ultimately lower the Total Cost of Ownership (TCO) for AI data centers.
Furthermore, amidst the backdrop of the United States' desire to increase semiconductor self-sufficiency, Micron has received significant financial support from the U.S. government to build a large storage wafer manufacturing plant.
Micron's American identity also facilitates easier access to other AI chip companies such as Intel and AMD, enabling Micron to secure more HBM orders.
In terms of production capacity, according to a TrendForce consulting report from March this year, Micron's HBM capacity at the end of 2023 was only 3,000 12-inch wafers per month, accounting for 3.2% of the overall market share.
By the end of 2024, Micron is projected to achieve a monthly production capacity of 20,000 wafers, with a market share expected to substantially increase to 11.4%.
Looking ahead to Micron's future product offerings, as reported by IT Home earlier, the 12Hi HBM3E memory with a single stack capacity of up to 36GB has completed sampling in early March, with plans for mass production in 2025.
In anticipation of the next-generation HBM4, South Korean media reports suggest that Micron aims to achieve the development of HBM4 memory in the latter half of 2025, with the completion of HBM4E development slated for 2028.