STMicroelectronics (ST) has announced its plans to build a comprehensive large-scale manufacturing hub in Catania, Italy, dedicated to producing 8-inch Silicon Carbide (SiC) power devices and modules while integrating manufacturing, packaging, and testing processes. By consolidating existing SiC substrate production facilities at the same location, STMicroelectronics aims to create a Silicon Carbide industrial park, fulfilling the vision of complete vertical integration and mass production of SiC within a single campus. The establishment of the new Silicon Carbide industrial park marks a significant milestone for STMicroelectronics, poised to assist customers in accelerating electrification and enhancing efficiency using Silicon Carbide in automotive, industrial, and cloud infrastructure sectors.
STMicroelectronics President and CEO, Jean-Marc Chery, stated:
The Catania Silicon Carbide industrial park will bring ST a fully vertically integrated SiC manufacturing capability, making a substantial contribution to maintaining ST's leading position in the automotive and industrial markets with SiC technology for decades to come. The economies of scale and synergies brought about by this project will enable us to leverage our large-scale manufacturing capacity for technological innovation, aiding European and global customers in accelerating their electrification transition, seeking high-efficiency solutions, and achieving their low-carbon emission goals.
As the hub of STMicroelectronics' global Silicon Carbide ecosystem, this Silicon Carbide industrial park will integrate all manufacturing processes, including SiC wafer substrate development, epitaxial growth techniques, 8-inch wafer manufacturing, module packaging, process development, product design, advanced bare die, power system, module development laboratories, and packaging testing. This project will become the first comprehensive manufacturing base in Europe for the one-stop production of 8-inch Silicon Carbide, consolidating every step of SiC production (substrate, epitaxy, wafer processing, and chip testing). To enhance chip yield and performance, the project will implement 8-inch wafer manufacturing technology.
The project is expected to commence operation by 2026 and achieve full capacity by 2033, with a wafer output of up to 15,000 pieces per week upon completion. The total investment for this project is estimated at around €5 billion, with the Italian government providing approximately €2 billion in funding support under the framework of the "EU Chip Act." The Silicon Carbide industrial park will be fully integrated with sustainable development principles from design, development to operation, ensuring responsible consumption of resources such as water and electricity.